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Against?the?background?of?the?war?in?Russia?and?Ukraine?and?the?impact?of?the?epidemic,?China's?economic?development?faces?a?complex?and?severe?international?and?domestic?environment.?The?global?economic?recovery?is?difficult?and?tortuous,?and?the?trend?of?major?economies?is?divided.?Downward?pressure?on?the?domestic?economy?continues?to?increase,?and?multiple?difficulties?and?challenges?are?intertwined.?China's?electronic?machine?assembly?equipment?industry?has?also?encountered?unprecedented?challenges.?The?difficulties?of?equipment?independent?innovation?and?transformation?and?upgrading?are?intertwined,?and?the?development?has?encountered?a?bottleneck?period.

Data?source:?China?Research?Century?Research?Report

Taking?Guangdong?Province?as?an?example,?there?are?a?large?number?of?electronic?information?manufacturing?enterprises?above?designated?scale?in?Guangdong?Province,?gathering?a?number?of?leading?enterprises?in?the?industry?such?as?Tencent?precision,?Xinwangda?and?Han's?laser.?In?2020,?the?main?business?income?of?the?top?3?target?regional?markets?of?the?head?enterprises?exceeded?2.5?million?yuan.?The?main?business?is?mainly?sales?of?mobile?phones,?consumer?electronic?parts?and?other?products?and?equipment.

Now,?with?the?deepening?of?the?integration?of?informatization?and?industrialization?in?China,?the?development?of?product?intelligence,?automation?and?flexibility,?the?demand?for?lead-free?electronic?products?and?new?packaging?technologies,?China's?industrial?chain?emergency?support?capability?and?perfect?industrial?chain?supporting?environment?and?supply?chain?collaborative?support?capability?are?showing?China's?strength?to?the?world,?It?also?provides?a?stable?traditional?market?demand?for?the?electronic?machine?assembly?equipment?industry?and?the?guidance?of?the?replacement?policy,?thus?bringing?new?market?growth?space.

According?to?the?research?of?China?Research?century,?the?development?trend?of?the?whole?machine?assembly?equipment?industry?in?the?future?is?mainly?towards?high?performance,?high?precision?and?miniaturization.?With?the?gradual?development?of?electronic?components?towards?miniaturization,?the?packaging?methods?will?also?be?constantly?improved?and?updated.?With?the?continuous?iteration?and?application?of?the?new?technology?in?the?manufacturing?process?of?the?electronic?whole?machine?assembly?equipment,?the?technical?requirements?for?the?whole?machine?assembly?are?constantly?refined,?so?the?accuracy?requirements?of?the?equipment?are?also?getting?higher?and?higher.